Maxtek Components Corp. (Beaverton, OR), a provider of turnkey packaging services for microelectronics, has added rapid prototyping to its suite of services. The company's rapid prototyping services are designed to help manufacturers speed up validation of integrated circuit and package designs as well as speed up the transition to full production. Three service levels are available, including ball grid array build-to-print service for least-complex prototyping. Advanced build-to-print and process evaluation build are offered to provide flexibility for custom requirements. Maxtek says that the new offerings came as a result of industry and voice-of-customer research.