Conductive Adhesives
A line of electrically conductive adhesives and potting compounds is designed to form paths where hot soldering operations would be ineffective or impractical. Suited for bonding or sealing electrical components or wires that require heat dissipation, Syon products also mix and pour easily, fill voids, and cure with minimal air entrapment. The Tru-Bond 206A conductive adhesive solder is a pourable silver-filled liquid epoxide; the Tru-Bond 214 silver-filled epoxy adhesive is a nonsagging paste that creates conductive paths on circuit boards and prepares electrodes for capacitance and loss measurements; the electrically and thermally conductive Tru-Bond 215 copper-filled epoxy adhesive is suited for preparing and repairing conductive paths on circuit boards and for RF-shielding and heat-sink applications; and the Tru-Cast 111 high-density potting and casting resin is an aluminum-filled epoxide resin featuring thermal conductivity and a low coefficient of thermal expansion. Devcon, Danvers, MA.
