
Fall 2007
Medical Electronics Manufacturing
Selected Contents
IMPLANTABLES
The Steady Shrinkage of Implantable Medical Electronics
Jim Ohneck
Three-dimensional chip-scale packaging and other new circuit assembly techniques are making the miniaturization of implantable devices a reality.
TESTING
Electromechanical Testing: Comparing IEC 62353 with IEC 60601
John Backes
The new IEC 62353 in-service test standard may alleviate some of the difficulties encountered with IEC 60601.
NETWORKING
Sidebars:
CiA 425 Receives FDA Clearance | An Operating Table at Work with CANopen
CANopen: A Technique for Networking Medical Devices
Monica Mack
CANopen technology provides a modular network that facilitates communication with other devices.
CAPACITORS
Minimizing Board Flexure Damage to Multilayer Ceramic Capacitors
Patrick Gormally, John Bultitude, and Vito Coppola
Techniques are emerging that minimize the incidence of a PCB component defect that can cause problems in devices.
Using Acoustic Imaging to Diagnose Singulation-Cracked MLCCs
Tom Adams
The incidence of performance failures in equipment can be reduced with an imaging technique that provides a quality assurance check.
EMBEDDED SYSTEMS
Exploring Networked Portable Devices
Lawrence Ricci
The commodification of power and communications subsystems is a key advance in embedded technologies for mobile and home-care devices.
Selecting the Proper Medical Embedded Board
Frank Shen
Seven steps are provided to help medical device OEMs select the appropriate embedded computer board and supplier.
Standardized Processing with Computer-on-Modules
Marc Brown and Matthias Huber
Medical electronics manufacturers should consider a new option in embedded computing systems.


