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Fall 2007
Medical Electronics Manufacturing
Selected Contents



FROM THE EDITOR


IMPLANTABLES

The Steady Shrinkage of Implantable Medical Electronics
Jim Ohneck

Three-dimensional chip-scale packaging and other new circuit assembly techniques are making the miniaturization of implantable devices a reality.


TESTING

Electromechanical Testing: Comparing IEC 62353 with IEC 60601
John Backes

The new IEC 62353 in-service test standard may alleviate some of the difficulties encountered with IEC 60601.



NETWORKING

CANopen: A Technique for Networking Medical Devices
Monica Mack

CANopen technology provides a modular network that facilitates communication with other devices.

Sidebars: CiA 425 Receives FDA Clearance | An Operating Table at Work with CANopen




CAPACITORS

Minimizing Board Flexure Damage to Multilayer Ceramic Capacitors
Patrick Gormally, John Bultitude, and Vito Coppola

Techniques are emerging that minimize the incidence of a PCB component defect that can cause problems in devices.

Using Acoustic Imaging to Diagnose Singulation-Cracked MLCCs
Tom Adams

The incidence of performance failures in equipment can be reduced with an imaging technique that provides a quality assurance check.



EMBEDDED SYSTEMS

Exploring Networked Portable Devices
Lawrence Ricci

The commodification of power and communications subsystems is a key advance in embedded technologies for mobile and home-care devices.


Selecting the Proper Medical Embedded Board
Frank Shen

Seven steps are provided to help medical device OEMs select the appropriate embedded computer board and supplier.


Standardized Processing with Computer-on-Modules
Marc Brown and Matthias Huber

Medical electronics manufacturers should consider a new option in embedded computing systems.