Originally Published MDDI February 2002
Elastomer compound offers a fast-curing alternative to moisture curing. A UV curable elastomer compound from Master Bond Inc. (Hackensack, NJ; 201/343-8983) offers an alternative to conventional moisture curing silicone materials for use-in-place seals, gaskets, bonding, and protective coatings. UV21 consists of a one-component, 100% reactive composition. Curing is achieved almost immediately when exposed to UV light of 320–365 nm and radiation dosages of 20–40 W/cm2. Average temperature range is from –65° to 250°F. Providing electrical insulation unaffected by exposure to moisture, UV21 improves resistance to most chemicals and adheres to glass and plastics, including polycarbonates and acrylics.
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Water-based coating technology receives patent approval. Containing no organic solvents, LubriLAST coatings provide lubricious, low-friction surfaces and do not require UV light for curing. Manufactured by AST Products (Billerica, MA; 978/667-4500), LubriLAST coating is made of a hydrophilic polymer network that forms a hydrogel coating and is fully cured through low-temperature drying conditions. It can be customized for antimicrobial and antithrombogenic agents, lubricious polymers, metals, and ceramic materials.First synthetic vascular sealing agent launched. Comprising two distinct polyethylene glycol polymers (biocompatible synthetic materials), CoSeal, a sealing agent, is latex-free and requires no light activation. It eliminates the risk of viral transmission. When applied, it forms an adhesive seal between itself and the tissue surface, remains intact through the wound-healing period, and is resorbed by the body within 4–6 weeks. In approximately three minutes, the hydrogel can be prepared and applied, achieving hemostasis by mechanically sealing areas of leakage. Manufactured by Cohesion Technologies Inc. (Palo Alto, CA; 650/320-5500), CoSeal could reduce patient recovery time and improve surgical outcomes, according to the manufacturer.
Dimer improves on coating thickness and uniformity. PCS Dimer, produced by Parylene Coating Services Inc. (Katy, TX; 281/391-7665) contains few contaminants, thereby offering better protection for substrates. To create the chemical precursor (diparaxylylene) used in the polymer deposition process, two identical molecules combine and are then heated to form a gaseous monomer that deposits evenly over substrate surfaces, including those with edges or cavities. Two forms of PCS Dimer are available: Parylene C, used for its electrical and physical properties, and Parylene N, offering dielectric strength for applications requiring greater coating penetration. Both are ISO 10993-6 and USP Class VI compliant, and they meet the requirements for MIL-I-46058C.
Adhesive designed for bonding silicon die. A two-component, low-stress, under-fill adhesive is suited for providing adhesion to FR-4 boards in packaging applications, as well as for bonding substrates with dissimilar coefficients of thermal expansion. Adhesive 122-24, manufactured by Creative Materials Inc. (Tyngsboro, MA; 978/649-4700), is thermally conductive and resistant to high temperatures. It is applied to substrate surfaces by screen printing, dipping, and syringe dispensing.
Phenolic resin coating for metal components. A high-
performance coating used for magnetic assemblies, PR1010 is now available for use on metal components as a final coat or primer on the metal before bonding. Manufactured by Magnetic Component Engineering Inc. (Torrance, CA; 800/989-5656), PR1010 impedes oxidation. Providing a high resistance to chemicals, this modified coating promotes bond longevity by inhibiting oxidation at the bond joints. The application process consists of grit-blasting the component surface with aluminum oxide, spray coating with PR1010 at a thickness of 0.0005 ± 0.0002 in, and oven curing the coating at 350°C for one hour. Standard coating is black, but a nonpigmented version is also available for applications requiring NSF certification.
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