Originally Published EMDM November/December 2002
PRODUCT UPDATE
Devcon
Electrically conductive adhesives and potting compounds can be used to bond or seal electrical components or wiring in applications that require heat dissipation and where hot soldering would be ineffective or impractical. The low-shrink and nonshrink epoxies and epoxy formulations mix and pour easily, completely fill voids, and cure with minimal air entrapment. Devcon (Danvers, MA, USA) offers several compounds for varying applications.
Tru-Bond 206A conductive adhesive solder is a pourable silver-filled epoxide with a 1- to 3-hour pot life and cure times of 72 hours at 75°F, or 2 hours at 130°F. It is suited for bonding electrical components that would be damaged by hot solder, and for joining materials to which hot solder would not bond. A conductive nonsagging silver-filled epoxy paste is also available.
An economical alternative to silver-filled products, a copper-filled epoxy adhesive is both electrically and thermally conductive. Tru-Bond 215 has a pot life of 45 minutes and cures at room temperature. Heating the adhesive to 150°F accelerates curing and ensures maximum electrical conductivity.
The company also offers an aluminium-oxide-filled epoxide potting and casting resin that effectively dissipates heat generated by electrical and electronic components. A choice of three curing agents allows the viscosity and pot life of the Tru-Cast 111 resin to be tailored for the intended use.
Copyright ©2002 European Medical Device Manufacturer
