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Esec

1407 W. Drivers Wy.
Tempe, AZ 85284 USA
Tel: 480-893-6990
Fax: 480-893-6793

E-mail: salesusa@esec.com

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Description:
Provides electronic component assembly equipment to semiconductor and medical device manufacturers. Products include die bonders, wire bonders, and flip-chip bonders, along with high-precision equipment for the assembly of optoelectronic components and MEMs.

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